Chinese Semiconductor Design Firms Turn to Malaysia for Advanced Chip Assembly Amid Growing U.S. Sanctions

As U.S. sanctions pose challenges to China’s chip industry, a rising number of Chinese semiconductor design companies are collaborating with Malaysian firms for the assembly of high-end chips. Focused on graphics processing units (GPUs), these companies seek to diversify and mitigate risks associated with potential U.S. expansions of sanctions. While not violating any U.S. restrictions, the assembly requests highlight concerns about future restrictions on sophisticated technology exports to China.

Malaysia, a major hub in the semiconductor supply chain, is strategically positioned to attract business from Chinese chip firms. Unisem and other Malaysian chip packaging companies have witnessed increased business from Chinese clients. Chinese firms also view Malaysia favorably due to geopolitical considerations, affordability, an experienced workforce, and advanced equipment.

Subscribe to Follow Global Trends for daily global news.

To Advertise, send a mail to advertise@followglobaltrends.com

Credit: Fanny Potkin and Yantoultra Ngui

Leave a Comment

Your email address will not be published. Required fields are marked *

Scroll to Top